Wrong Thermal Pads: Tear-Down of MSI RX 5700 XT Evoke OC

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MSI’s RX 5700 XT Evoke OC is insufficiently designed in significant, odd ways, like the 50% contact between the memory modules and the heatsink. We were surprised and disappointed to see a thermal solution like this go to such waste. The thermal pad thickness is also an issue — everything should be brought closer to the card, ideally, to reduce the thickness of the interface connecting the hotter devices to the heatsink.

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Host: Steve Burke
Video: Andrew Coleman

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